Silicon wafers and supports

Polished silicon is an excellent substrate for imaging experiments, nanotechnology and micro-fabrication applications. For imaging applications, silicon wafers offer an ideal sample substrate for small particles due to the low background signal of the highly polished surface. For biological applications silicon resembles glass, which makes it a suitable support for growing and/or mounting cells.

Our silicon wafers and silicon chips are all P-type, doped with boron to provide excellent conductivity for SEM, FIB and STM applications. They are available as silicon wafers, diced silicon wafers or as smaller silicon chips (pieces). Silicon wafers and silicon chips all have a <100> orientation. Cleaving of the silicon wafers to the desired size with a <100> orientation  is straight forward and simple.

Two grades of silicon substrates are offered:

• Micro-Tec standard silicon wafers and silicon chips for standard applications and medium resolution imaging.
• Nano-Tec ultra-flat silicon wafers and ultra-flat silicon chips for demanding applications and high resolution imaging.

Related products:

We also offer a range of wafer holders  for using  silicon wafers in all brands of SEM.

Our wafer carrier trays provide protection for  silicon wafers during storage.

For precise breaking of silicon wafers we also offer Wafer cleaving pliers.

Micro-Tec silicon wafer substrates from Micro to Nano are a useful flat substrate for SEM imaging of particles due to the low background and can also be used as sample substrates, micro-fabrication and as substrates for thin film research or biological substrates. Micro-Tec silicon wafers are packed in a wafer carrier tray for protection. Diced silicon wafers are supplied on wafer adhesive discs and packed between two plastic sheets for protection. Silicon chips can be easily lift off the adhesive sheet.

Micro-Tec standard silicon wafer substrates are available as:

• Ø2”/51mm silicon wafers
• Ø4”/100mm silicon wafers
• Ø6”/150mm silicon wafers
• Diced Ø4”/100mm silicon wafer in 5x5mm silicon chips (~270 pieces)

Nano-Tec, ultra-flat P silicon wafers have higher specifications than Micro-Tec silicon wafers. They are preferred for demanding applications in micro-fabrication, as substrates for thin film research or biological substrates. The larger wafers with the <100> orientation can be easily cleaved to the desired size. Ultra-flat Nano-Tec Si wafers are clean-room packed in a wafer carrier tray for protection. The ultra-flat Si chips are precision diced with a dicing saw, cleaned and clean-room packed in a gel-box. They can be easily lift off the gel substrate with flat tipped tweezers.

Nano-Tec ultra-flat silicon wafers are available as:

• Ø4”/100mm <P/100> ultra-flat silicon wafers
• Ø6”/150mm <P/100> ultra-flat silicon wafers
• Ultra-flat 5x5mm Si chips;  25 packaged in a gel box
• Ultra-flat 5x5mm Si chips with 200nm thermal SiO2; 25 packaged in a gel box